Project: Redesigned Plastic Sensor Enclosure
 

Objective – Redesign sensor enclosure for OEM customer:
Develop multi level switch to increase number of detectable levels from one level to 4 or 5 levels. 
Keep within overall enclosure dimensions, however, detect higher level if possible.
This allows for a gauge display 0%, 25%, 50%, 75%, 100% instead of binary on/off signal.

No change to enclosure material or to float component design, in order to reduce time for acceptance testing.

Secondary objective to reduce material costs. 
Gain full control of mould tooling by removing expensive component; unit cost having increased by 60% over previous 2 years.

​

Timescale - 6 months for development of concept including 3 months’ tooling time
Requirements - Provide guidance for client and produce working prototypes of next generation sensor & for client’s onsite approval testing.  
PPAP for implementation. 

​

Tools - SOLIDWORKS for enclosure design, workshop for prototype manufacture, 3rd party rapid prototype techniques from STP file.
Wire Spark Erosion Machining for injection mould plate manufacture. KEYSHOT for final renders.